dl-breadcrumbs__homedl-breadcrumb-item__separatorSystem overview, planning and operationdl-breadcrumb-item__separator...dl-breadcrumb-item__separatorWiringdl-breadcrumb-item__separatorEMC-conforming assembly and constructiondl-breadcrumb-item__separatorEquipotential bonding
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Equipotential bondingdl-permalink__symbolPermalink

The Installation of equipotential bondings are necessary if there are present or expected potential differences between parts of your application.

  • The impedance of equipotential bonding must be equal or lower than 10 % of the shield impedance of the shielded signal cables between the same points.

  • The conductor cross section of a equipotential bonding must be 16 mm² to withstand the maximum possible compensating current.

  • Equipotential bondings and shielded signal cables should be laid close to each other.

  • Equipotential bondings must be connected to PE with low impedance.

Fig. 17: AC500, equipotential bonding
Equipotential_Bonding
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Cabinet 1

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Cabinet 2

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Power supply for the CPU

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Fuse for the CPU power

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Power supply for the I/Os

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Fuse for the I/O power

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For fuses for the contacts of the relay outputs

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0V rail

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Grounding of the 0V rail

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Cabinet grounding

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Equipotential bonding between the cabinets min. 16 mm2

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Cable shields grounding

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Fieldbus connection (e.g. Ethernet)