For a detailed description of the mounting, disassembly and connection of the module, please refer to the ⮫ installation instructions.
The modules are plugged on an I/O terminal unit.
Properly position the modules and press until they lock in place. The terminal units are mounted on a DIN rail or with 2 screws plus the additional accessory for wall mounting.
⮫ “TA526 - Wall mounting accessory”
The connection of the I/O channels is carried out using the 40 terminals of the I/O terminal unit. I/O modules can be replaced without re-wiring the terminal units.
The internal logic of the module is supplied by the I/O bus.
The input/output circuits are powered by the process voltage:
Process voltage UP = +24 V DC. Terminals 1.8 ... 4.8 are internally connected in the terminal unit.
Process voltage ZP = 0 V DC. Terminals 1.9 ... 4.9 are internally connected in the terminal unit.
The maximum current load capability of the terminals must be taken into account.
1
I/O bus interface to the CPU or communication interface module
2
Internal logic and I/O circuits of the module
3
Analog outputs
4
Functional earth connection between terminal unit and DIN rail
WARNING
Removal/Insertion under power
Removal or insertion under power is permissible only if all conditions for hot swapping are fullfilled.
⮫ “Replace an I/O module with hot swap”
The devices are not designed for removal or insertion under power when the conditions for hot swap do not apply. Because of unforeseeable consequences, it is not allowed to plug in or unplug devices with the power being ON.
Make sure that all voltage sources (supply and process voltage) are switched off before doing any of the following actions:
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Connect or disconnect any signal or terminal block.
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Remove, mount or replace a module.
Disconnecting any powered devices while they are energized in a hazardous location could result in an electric arc, which could create an ignition source resulting in fire or explosion.
Prior to proceeding, make sure that power is disconnected and that the area has been thoroughly checked to ensure that flammable materials or ignitable concentrations are not present.
The devices must not be opened when in operation. The same applies to the network interfaces.
CAUTION
By installing equipotential bonding conductors between the different parts of the system, it must be ensured that the potential difference between ZP and AGND never can exceed 1 V.
CAUTION
The process supply voltage must be included in the grounding concept (e. g. grounding of the negative terminal).
CAUTION
Analog sensors must be galvanically isolated against the ground. In order to avoid inaccuracy with the measuring results, the analog sensors should also be isolated against the power supply.
NOTICE
Risk of damaging the PLC modules!
Overvoltages and short circuits might damage the PLC modules.
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Make sure that all voltage sources (supply voltage and process supply voltage) are switched off before you begin with operations on the system.
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Never connect any voltages or signals to reserved terminals (marked with ---). Reserved terminals may carry internal voltages.
Generally, analog signals must be laid in shielded cables. The cable shields must be grounded at both sides of the cables. In order to avoid unacceptable potential differences between different parts of the installation, low resistance equipotential bonding conductors must be laid.
The negative poles of the analog inputs Ix- may accept a potential difference up to ±20 V DC with regard to the common reference potential IxB (AGND, ZP). Observing this maximum voltage difference, analog current inputs of one module can be switched in series to each other and also with current inputs of other modules.
For the open-circuit detection (wire break), each positive analog input channel Ix+ is pulled up to "plus" by a high-resistance resistor and each negative analog input channel Ix- is pulled down to "minus" by a resistor. If wire break occurs, a maximum voltage (overflow or underflow) will be read in then.